ACTIVE
Updated 21st January, 2026
Conference
DigiTwin 2026 : The 6th Digital Twin International Conference
Conference Dates
August 4-8, 2026
Venue Location
Oxford, UK
About the Conference
Call for Papers, Presentations, and Posters
The 6th Digital Twin International Conference (DigiTwin 2026)
Oxford, United Kingdom and Online
Wednesday, August 19 - Thursday, August 20, 2026
https://idea-global.net/digitwin2026/
Presentation Abstract/Poster Submission Deadline: June 15, 2025
CONFERENCE DESCRIPTION
The Digital Twin International Conference (DigiTwin) is a premier global forum dedicated to advancing the science, technology, and engineering of digital twins. Organized under the guidance of the Digital Twin International Advisory Committee (DTIAC) and hosted by the International Digital Engineering Association (IDEA), the conference fosters communication and collaboration among leading academics, industry innovators, and practitioners worldwide.
Building on the success of its previous editions, DigiTwin 2026 will be held in a hybrid format at the historic University of Oxford. The conference will feature keynote speeches by renowned experts, invited presentations, and interactive poster sessions. Articles published in our affiliated journals by June 30, 2026, will be eligible for the DigiTwin 2026 Best Paper Award.
SCOPE AND TOPICS
DigiTwin 2026 invites contributions on all aspects of digital twin technology. Topics of interest include, but are not limited to:
Fundamentals: Concepts, architectures, standards, and theoretical foundations.
Enabling Technologies: AI/ML integration, IoT, big data analytics, cloud/edge computing, and security.
Applications: Smart manufacturing, smart cities, aerospace, automotive, healthcare, robotics, and sustainable energy.
SUBMISSION TYPES & POLICIES
1. Call for Papers (Journal Submission)
While the conference will not publish standalone proceedings, authors are invited to submit their work for publication and presentation through our affiliated journals:
Digital Twin (Taylor & Francis)
Digital Engineering (Elsevier)
Authors may also submit papers directly to the journals following their standard procedures.
All accepted papers will be published as journal articles. At least one author of each accepted submission must register and attend the conference to present.
2. Call for Presentations
We invite proposals for oral presentations from both academia and industry.
Submission: Please email your presentation title, abstract (300 words), and short biography to [email protected].
3. Call for Posters
This is a key opportunity to present research visually and engage in direct discussion.
All presented posters will be eligible for the DigiTwin 2026 Best Poster Award.
For inquiries, please contact the secretariat at: [email protected]
The 6th Digital Twin International Conference (DigiTwin 2026)
Oxford, United Kingdom and Online
Wednesday, August 19 - Thursday, August 20, 2026
https://idea-global.net/digitwin2026/
Presentation Abstract/Poster Submission Deadline: June 15, 2025
CONFERENCE DESCRIPTION
The Digital Twin International Conference (DigiTwin) is a premier global forum dedicated to advancing the science, technology, and engineering of digital twins. Organized under the guidance of the Digital Twin International Advisory Committee (DTIAC) and hosted by the International Digital Engineering Association (IDEA), the conference fosters communication and collaboration among leading academics, industry innovators, and practitioners worldwide.
Building on the success of its previous editions, DigiTwin 2026 will be held in a hybrid format at the historic University of Oxford. The conference will feature keynote speeches by renowned experts, invited presentations, and interactive poster sessions. Articles published in our affiliated journals by June 30, 2026, will be eligible for the DigiTwin 2026 Best Paper Award.
SCOPE AND TOPICS
DigiTwin 2026 invites contributions on all aspects of digital twin technology. Topics of interest include, but are not limited to:
Fundamentals: Concepts, architectures, standards, and theoretical foundations.
Enabling Technologies: AI/ML integration, IoT, big data analytics, cloud/edge computing, and security.
Applications: Smart manufacturing, smart cities, aerospace, automotive, healthcare, robotics, and sustainable energy.
SUBMISSION TYPES & POLICIES
1. Call for Papers (Journal Submission)
While the conference will not publish standalone proceedings, authors are invited to submit their work for publication and presentation through our affiliated journals:
Digital Twin (Taylor & Francis)
Digital Engineering (Elsevier)
Authors may also submit papers directly to the journals following their standard procedures.
All accepted papers will be published as journal articles. At least one author of each accepted submission must register and attend the conference to present.
2. Call for Presentations
We invite proposals for oral presentations from both academia and industry.
Submission: Please email your presentation title, abstract (300 words), and short biography to [email protected].
3. Call for Posters
This is a key opportunity to present research visually and engage in direct discussion.
All presented posters will be eligible for the DigiTwin 2026 Best Poster Award.
For inquiries, please contact the secretariat at: [email protected]
Topics of Interest
Research papers are invited in, but not limited to, the following areas: